There is not standard for the force to pull an axial lead from a soldered connection.
".....IPC does not have pull tests in any of its standards, and some reliability experts would prefer to keep it that way, pull tests are commonly used by some leading companies. Much data collection and rigorous analysis has gone into this technique, and it has been found to be stable and capable." [Ray Prasad, SMT magazine 8/05 regarding the new IPC-7095 revison]
We'd expect that with a properly formed solder connection that you'd pull the copper from the board in a lead-peeling test. Copper foil adhesion strength: 20kgf/cm (Murata)
What are you trying to accomplish with such a test?