Collapsing of micro bga ball due to improper land pad design ?

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Hai, In our process we are using the micro bga of size 13X... - Aug 22, 2008 by ramesh.r

Hi, what do you mean by collapsed ? Can you describe or s... - Aug 22, 2008 by Andrzej

Dear Andrezj, i had attached the photos for ur reference ... - Aug 25, 2008 by ramesh.r

Yes, it's peculiar that the layout of this board is so disor... - Aug 25, 2008 by davef

Dear davef, Will u pls advice what are all the possible de... - Aug 27, 2008 by ramesh.r

We'd expect to see: * Solder starved connections at pads wi... - Aug 27, 2008 by davef

ramesh.r

#56106

Collapsing of micro bga ball due to improper land pad design ? | 22 August, 2008

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads are not in circular shape. can anybody help us to find out the rootcause for the above problem.

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Andrzej

#56108

Collapsing of micro bga ball due to improper land pad design ? | 22 August, 2008

Hi,

what do you mean by collapsed ? Can you describe or send a photo ?

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ramesh.r

#56140

Collapsing of micro bga ball due to improper land pad design ? | 25 August, 2008

Dear Andrezj, i had attached the photos for ur reference

Kindly advice.

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davef

#56142

Collapsing of micro bga ball due to improper land pad design ? | 25 August, 2008

Yes, it's peculiar that the layout of this board is so disorganized * Pads are not round, uniform, or the same size * Exposed traces have different thickness

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ramesh.r

#56185

Collapsing of micro bga ball due to improper land pad design ? | 27 August, 2008

Dear davef, Will u pls advice what are all the possible defects caused while soldering ( assembling ) this type of boards.

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davef

#56193

Collapsing of micro bga ball due to improper land pad design ? | 27 August, 2008

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

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