Replating a Gold Connector

J-STD-001 requires that solderable surfaces of components and connectors be degolded prior to soldering. As proven methods for removal of the gold plating and replacing it with tin/lead, MIL-STD-2000 and J-STD-001 endorse[d] either: * Double dip (two solder pots) immersion ... OR * Flowing solder wave. Further, J-STD-001 calls for documention showing that your method of removing the gold is sufficient to provide for reliable assembly operations.

Services, Part, Degolding * Oracle Components, (aka ICsrus) http://www.oraclecomponents.com

* Chip Process, Inc; http://www.chipro.com AZ: Sales & Marketing, Technical Info. 10390 E. Lakeview Drive #206 Scottsdale, AZ 85258; 480-860-5790 F480-860-8366 TX: Processing Facility, 1610 N. Interstate 35E #214 Carrollton, TX 75006; 972-242-9455 F972-242-9455 * Corfin Industries; 7B Raymond Ave, Salem, NH 03079; 603-893-9900 F603-893-6800 http://www.corfin.com

* Epolar System Enterprise Pte Ltd; 21, Senang Cresent, 416594, Singapore; 65-6448-7093 F65-6448-7012 http://www.epolarsystem.com/degold__solder_coat_service

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