We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions.
One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB from the other. Basically like having two boards with a solid shield (no vias within).
While I do not currently know the material, does anyone out there have experience with this type PCB? Are you familiar with this type board and are you aware of any special processing requirements (primarily thermal) to prevent warping, delamination,etc.?
This same customer has another assembly that has a multi layer board, however the sides are plated, much like gold fingers, but this plating is 100% around the perimeter edges. The purpose of this is to basically seal the laminate from moisture. The same questions above apply, especially any special handling to prevent plating damage.
A third question, concerning sealing BGA's. This customer has had field failures as a result of moisture ingress under the part (I do not currrently know the environment), despite the assembly being conformal coated. Whatever solution is determined to be effective must be re-workable, which leaves RTV or potting material and such materials (customer mentioned this not us) out of the question. What is available (product or process) to seal the perimeter of BGA packages totally?
As always, appreciate any insights you might provide.
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