BGA re-balling yields

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We are in a position where we have to purchase Leadfree BGA'... - Apr 20, 2009 by C111

Cood Morning, We have a similar situation. We have had a ... - Apr 22, 2009 by CL

Thanks! We would outsource as we do not have the man power ... - Apr 22, 2009 by C111

There was a paper recently presented by R Cirimele at the CA... - Apr 30, 2009 by reworkexchange

C111

#58631

BGA re-balling yields | 20 April, 2009

We are in a position where we have to purchase Leadfree BGA's and have them re-balled as leaded. I'm looking for some data from anyone who has done large volume outsource.

1) What percent fallout should I expcet from the re-balling process. 2) After you changed to this process (in place of running standard leaded BGA's) did you defect rates increase do to BGA failures? if so by what percent? 3) Did your customer returns increase?

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#58635

BGA re-balling yields | 22 April, 2009

Cood Morning,

We have a similar situation. We have had a large volume (5K) of RoHS BGA's reballed with 63/37. We have had only a few failures most of which do not appear to be related to that particular BGA. Potential BGA failures are running under .05%. Having said that, I would run a small sample before committing any large volume of components to this process. Are you looking at outsourcing this reballing or performing this operation in house?

Chris

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C111

#58636

BGA re-balling yields | 22 April, 2009

Thanks! We would outsource as we do not have the man power for this effort

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reworkexchange

#58695

BGA re-balling yields | 30 April, 2009

There was a paper recently presented by R Cirimele at the CALCE Reliability symposium in which extensive testing was done on a part (thermal stress, vibration, shock) after numerous reballing cycles. This show no failures on the reballed parts.

In terms of the process yield for plastic parts one whould expect a 90-92% yield and 70-75% for ceramic parts. The nice thing about outsourcing is that the vendor of the service takes this hit.

Generally for large reballing projects I would recommend the proper testing of the reballed devices based on the end use environment.

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