We are looking at feasibility concerns of using a QFN 16 from Motorola. I have a couple of questions regarding their recommended PCB design guidelines.
1) Does anyone know why they would recommend coming out of the pads with a narrow trace (.1mm width for a distance of .5mm) and then widening it? 2) Why would they recommend a 2 mm keepout around the package land area?
I attached their datasheet showing their recommended PCB design.
Does anyone have any experience with this part? Anything that the Motorola recommendations do not cover?