Printed Circuit Board Assembly & PCB Design Forum
SMT electronics assembly manufacturing forum.
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We are currently wirebonding MCMs with surface components l... - Oct 08, 2009 by CB
Hi, Is your problem solved? If yes then how? Have you tr... - Oct 26, 2009 by Mysmt
Hi. We are doing Au bonding on Al bond pad not Au plated. ... - Oct 29, 2009 by Jeong Ju-young
We have performed some EDS analysis and found high percent (... - Oct 30, 2009 by CB
> We have performed some EDS analysis and found > hi... - Oct 31, 2009 by Mysmt
Au measured out( using XRF)at 55-75micro-inches. Within spe... - Nov 02, 2009 by CB
Ni is coming up through soft Au. Sam forman ... - Nov 30, 2009 by sforman1