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Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


High Melting Point Solder Paste

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#60728

High Melting Point Solder Paste | 24 December, 2009

Has anyone had any experience of using High Melting Point Solder paste in production. We have started to trial some boards using the Solder Paste and are experiencing poor solder joints and solder joints that look grainy.

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#60735

High Melting Point Solder Paste | 25 December, 2009

Compared to 63/37, solder with high tin content: * Requires higher reflow temperatures * Demands tighter process control * Results in duller, more grainy looking solder connections

Tell us about the specific problem that you seek help in solving.

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JAX

#60738

High Melting Point Solder Paste | 28 December, 2009

What solder are you talking about and what reflow method are you using?

High Melt Alloys:

SN96 (Sn96/Ag4 or Sn96.5/Ag3.5) - Simliar to SAC305 although normally uses Rosin based flux that can required more extensive cleaning.

Pb85 (Pb85/Sb10/Sn5) - Can be Automated with Vapor Phase for Surface Mount... Convection Reflow is possible if delta T° is minimal. PTH automation is possible with proper fluxing and preheating.

HMP (Pb93.5/Sn5/Ag1.5) - Normally Hand Soldered. Automation of Surface Mount is available with limited success using Laser although Solder Mask burning is the normal deterrent. PTH automation is possible with proper fluxing and preheating.

Gold (Au80/Sn20) - Hand Solder only. Cost prohibitive for automation.

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