Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Re: PIHR

Is the temperature the only drawback when reflowing compone... - Jul 20, 2000 by Jeanette   via

In real terms the temperature compatibility is the real iss... - Jul 20, 2000 by Bob Willis   via

Jeanette

#6365

PIHR | 20 July, 2000

Is the temperature the only drawback when reflowing components other than connectors? for example caps, transformers.

Is there a problem with the soldering quality if the body of the component covers the solder paste?

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Bob Willis

#6366

Re: PIHR | 20 July, 2000

In real terms the temperature compatibility is the real issue.

Yes a component can and in most case will cover the paste. The component standoffs must prevent the body contacting the paste to prevent solderballing.

Bob Just back from dinner, my mum called me away !

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