We are working on placing an RF shield.
Sometimes we have been dispensing paste (if the board is already populated), othertimes we have been printing the paste pattern (unpopulated board).
Now we have a case where the customer is insisting on a preform in order to tightly control the solder paste volume.
Does anyone have any likes/dislikes (besides paying an arm and a leg for the preform and it taking forever)for this method of applying paste?
Thanks
BWET
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