Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those little preform remnants everywhere!
IIRC - After completing the reflow, you'll need a soak in DI water for a few minutes (be patient), then peel with a tweezer, and finally use a soft brush to remove the extra bits. At least it used to work that way with the Winslow/Solderquik product. 'hege I have no affiliation, nor receive any benefit from any company listed above.