I wouldn't get too tightly wrapped around the axial of paste suppliers recommendations of thermal recipes. Said another way, "Do not count on the solder paste representatives for good technical advice--they are the ones who came up with these "'TIME ABOVE 183" or "TIME ABOVE LIQUIDUS" concepts, which are technically woefully inadequate." [W Engelmaier]
Your supplier says: * ramp up rate(30~150 ?) : 1.0~2.0 ?/sec * pre-heating time(155~185 ?) : 30~120 sec * time period above 220 ? : 30~100 sec * ramp up rate during reflow: 1.0~2.0 ?/sec * peak temperature: 230~250 ? * ramp down rate during cooling: 1.0~6.0 ?/sec
... That's a fairly broad range [for each of those characteristics] Your board design and the components on the board are other factors that you need to consider in selecting the characteristic of your thermal recipe.
The most coherent discussion of thermal profiling is here: IPC-7530 Guidelines for Temperature Pro?ling for Mass Soldering Processes (Re?ow & Wave) [ipc.org/TOC/IPC-7530.pdf?]
Each of the major thermal profiler device suppliers offer excellent discussion of their approach to developing recipes on their sites. Profiler suppliers that come to mind are: * kicthermal.com * ecd.com * datapaq.com * circuitmaster.co.uk/profiler.html
Here are some papers that may help: * car-san.com/specials_pdfs/doc_20090427144226.pdf * ems007.com/pages/zone.cgi?a=60702 * conceptronic.com/products/solder-reflow-technology-handbook/section3.pdf * axiomsmt.com/articles/global8.4us.pdf
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