Component Tinning Equipment Options (Automated preferred)

Hi All,

We leadform components for our assemblies in house and have been tinning the leads using a dip methood by hand into a solder pot. by just handling the components during the tinning and cleaning process we are at times damaging the parts/lead bends. We are considering the acquisition of an automated system to help remove the operator error from the equation, however i'm not familiar with products on the market. Can anyone provide suggestions of what they've worked with and or like?

We leadform and need to tin a range of high-rel components from QFPs to Flatpack SOICs to through hole axial leaded compnents etc. occationally there are Leadless Chip Carriers (LCCs) that get re-tinned.

Thanks

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