Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

BGA Rework options

Rob Douglass


BGA Rework options | 3 February, 2000

Looking for opinions out there regarding the use of I.R. vs. Hot Air for BGA removal and replacement. Thanks for your input.

reply »


Re: BGA Rework options | 3 February, 2000

I have used a PDR I.R. machine for BGA repair and I personally liked it. The two big features I liked were no special tooling and it has a IR temp probe that is closed loop and will keep the temp where you programmed it. The vision allignment works well but is easily knocked out of allignment and it is somewhat difficult to reallign. Good luck

reply »


Re: BGA Rework options | 3 February, 2000

I have worked with the PDR type rework station on and off for 12 years and have found that the IR can offer a lot of advantages over hot air. As was mentioned the lack of nozzels is a great advantage. The back heater takes a while to warm up but once it reaches temp. it will heat the hole factory. There are newer alignment tools for aligning the vision cube, this makes calabration far easier. Adjacent component heating is not as bad as with some hot air systems. With IR you can access the component during the reflow cycle. The main disadvantage of IR is when you try to rework a very large heavy PCB with a lage metal BGA. This can become a very difficult task. I have seen a new option for a larger back heater. This could be a good improvment to the system as well as the process. When you start to open the IR spot over 75mm the power drop off could force you to have to use more bottom heat to achive the comoponent reflow. This is something you will have to decide.

Hope this is of help.

Gary Miller

reply »

Lisa Anderson


Re: BGA Rework options | 4 February, 2000

We are currently using an Air-Vac DRS24 hot air BGA/SMD rework unit. Most of our nozzles are designed to channel the exhaust away from nearby components. This and a minimum keepout of .100" has prevented any issues with secondary reflow of those components. The station can handle up to 8 thermocouples for profiling and the actual profile programming is user-friendly. Hope this is helpful.

reply »

APE South


Re: BGA Rework options | 4 February, 2000

We are using an A.P.E. Sniper Split Vision System and are very happy with it's ease of operation and capabilities. It uses very low velocity air so we have zero problems with parts being blown off the board.

Another reason we went with the Sniper was because Motorola does not want IR systems used on their stuff because of the heat. The Sniper works nicely at convection oven temps....450f range.

reply »

Electronics Equipment Consignment

IPC Certification Training Schedule