Interposer Vendors

I am currently working on a custom IC where we plan on using Cu pillars at 80um pitch. I'm am trying to narrow down a packaging solution.

My requirements are as follows:

40um Line Width/Space Capability (or finer)

4 layers

low loss at mm-wave frequency (75 GHz)

substrate size up to 40mm x 20mm

I do not have any demanding via requirements as the majority of critical signals are on the periphery of the die.

I have been able to find a lot of journal and white papers online that suggest these capabilities are very achievable. But I have had a difficult time compiling a list of vendors who offer this capability. I am not tied to any specific substrate material (silicon, LTCC, LCP, etc) as long as it has acceptable electrical characteristics at 75 GHz and is compatible with the thermo-compression bonding required for Cu pillar packaging.

I would appreciate any recommendations on vendors who can achieve this so that I can attempt to determine a cost optimal solution.

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