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SMT electronics assembly manufacturing forum.


led tilt reduction by reducing convection air speed in reflow oven

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#79471

led tilt reduction by reducing convection air speed in reflow oven | 14 December, 2017

Can anybody suggest how can I achieve good solderability in convectional reflow oven If I reduced Convection Air Speed 80%. The whole purpose is to reduce 0402 LED tilting in the convectional reflow and the PCB having QFN with 60 to 120 sec soak, 30 to 90 sec reflow, and 245 to 250 peak temp.

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#79472

led tilt reduction by reducing convection air speed in reflow oven | 14 December, 2017

picture of the problem would help people to speculate what you do wrong

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#79484

led tilt reduction by reducing convection air speed in reflow oven | 14 December, 2017

I am pretty sure, you are looking into the wrong spot. Your paste is too much, or your part has very inconsistent narrow leads(that includes wrong pad design as well.)

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#79502

led tilt reduction by reducing convection air speed in reflow oven | 20 December, 2017

I agree with Evtimov. What he didn't point out is that the surface tension of the solder would vastly overwhelm any force from air flow.

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Flexible high speed pick & Place

Reflow Oven