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DDR3 - BGA VDD and VDDQ Pins - Design Guidelines

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#80164

DDR3 - BGA VDD and VDDQ Pins - Design Guidelines | 5 April, 2018

Recently we have seen the BGA Ball collapsing issue in the field. The unit has the clean manufacturing records at factory, But in the same unit we did the cross section and found Ball explosion only in VDD and VDDQ pins. Can anyone help me to understand the reason for explosion only one these pins?

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#80180

DDR3 - BGA VDD and VDDQ Pins - Design Guidelines | 9 April, 2018

Hi, these are both power pins, usually connected to a dedicated inner VDD/VDDQ 1oz copper layer, making a very effective heatsink.

I am guessing that not enough heat got to the ball to fully melt it, creating a weaker column rather than a beautifully melted ball joint.

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#80183

DDR3 - BGA VDD and VDDQ Pins - Design Guidelines | 9 April, 2018

are there unplugged vias on the BGA pads?

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