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Stencil and paste used for .4mm pitch csp component ball size .3mm?

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#80962

Stencil and paste used for .4mm pitch csp component ball size .3mm? | 24 August, 2018

What do others use as far as solder paste type, stencil thickness and aperature size for a .4mm Ball Pitch CSP. Ball diameter is .3mm. Please let me know your thoughts or what you use. Thanks

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#80968

Stencil and paste used for .4mm pitch csp component ball size .3mm? | 29 August, 2018

It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they have done a great job

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#80976

Stencil and paste used for .4mm pitch csp component ball size .3mm? | 30 August, 2018

I don't know your board, but for this specific part:

10mil round aperture on a 3.5mil stencil with type 4 paste wold be ideal

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