CSP assembly compliance to IPC-A-610 minimum electrical clearance

Hi,

Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, this min. clearance seems difficult to achieve...

Thanks for your comments

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