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My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish i...
- Dec 22, 2018
TIN LEAD SILVER BGAS | 22 December, 2018
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product.
1. Is there any long term reliability issues with 2% Ag in BGA Ball.
2. If the PCB finish is ENIG will there be degradation in the reliability.
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