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Solder joint crack

Views: 2611

#82674

Solder joint crack | 31 May, 2019

What are the common cause for solder joint crack after the pcba go through Temperature cycling test ?We have seen failure on solder joint for the memory part.

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#82677

Solder joint crack | 31 May, 2019

Major sources of crack in the solder connection after thermal cycling are:

* Thermal heating caused by differences in thermal expansion between the board and the component

* Lead-free solder is more rigid and brittle than eutectic solder in similar conditions

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#82680

Solder joint crack | 31 May, 2019

Thanks Dave..My customer proposing to reduce the solder volume.Can the TCT be improved by reducing the stand-off height?

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#82682

Solder joint crack | 1 June, 2019

Depends on lead free alloy choice as well

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#82686

Solder joint crack | 1 June, 2019

Just the opposite, reducing the standoff increases the shear strain range in temperature cycling, which lowers the number of cycles to failure.

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#82690

Solder joint crack | 3 June, 2019

Is there any chance that the boards were mechanically stressed (for instance, installed in a fixture) before, during, or after the testing?

I'm just looking for other possible root causes.

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#82878

Solder joint crack | 24 June, 2019

You may need tell us the background, how PCBA being tested, the test setting and spec. Solder crack maybe due to CTE mismatch or mechanical strain.

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#82881

Solder joint crack | 25 June, 2019

See also ... https://www.semlab.com/solder-joint-failure-modes/

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