In “J-STD-001 Rev G Amendment 1 Process Qualification” Debbie Carboni, Global Product Line Manager, KYZEN Corp, Nashville, TN said:
What change constitutes a need for requalification?
Major/ Level 1 – Flux or flux-bearing materials (e.g. flux, solder paste, paste flux, cored wire solder) [Requalification Required]
■ Different residues, different activators, different solubilities – Cleaning agents (e.g. solvents, aqueous detergents, topical cleaners)
■ Differences in surface tension, ability to get under low standoff devices – Changes in manufacturing suppliers
■ There may be a reason they are half the price – Changes in solder mask type
■ Changes in porosity, surface energy, etc. – Changes in printed board fabrication processes or surface metalization
■ See IPC-5703 – Geographic change in manufacturing location
■ Change in cultures, training, supply chains
Minor/ Level 2 -Intent was to be a lesser effort - Changes in cleaning parameters: [Requires Supporting Evidence]
■ Increase in belt speed (in-line cleaning systems), or decrease in cycle time (batch systems).
■ Decrease in pressures or flow rates.
■ Decrease in the wash or rinse temperatures.
■ Any changes in these process parameters that are beyond the recommended process windows for the equipment or chemistry suppliers. - Changes in reflow, wave solder, or selective solder recipes
■ Beyond the recommended process windows established by the equipment, flux, or paste suppliers - Changes within a manufacturing location
■ Moving a line from Plant A to Plant B or Location A to Location B
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