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Reflow Oven

Views: 262

#83252

Reflow Oven | 13 August, 2019

We are using Wertheim SMT Reflow oven.We are facing component drop issue from bottom side while top side is running. The drop components is diode,3 pin transitor which not even too heavy..We are also getting tombstone in bottom side Chip capacitor while top side is running. and all issue occurence components bottom side AOI result is good. Kindly suggest some tips to close this issue

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#83253

Reflow Oven | 13 August, 2019

Too much heating on the bottom side surely?

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#83255

Reflow Oven | 13 August, 2019

It Satisfy Profile Condition

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#83258

Reflow Oven | 13 August, 2019

A profiler can't distinguish where your heat is coming from, so if you're significantly imbalanced between top and bottom heat (could be an oven problem or your settings) it might still be a cause.

You don't say whether or not your top and bottom settings are the same.

Is this a SOT23, or a SOT3, or.....?

According to a few references I found here, you're looking for something less than 30 grams/sq. in of soldered area for your first pass parts to survive during the second pass.

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#83297

Reflow Oven | 16 August, 2019

To be in the range of profile for a paste, doesn't mean it is ideal. Check temperature on the Side A components while running side B profile.

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#83302

Reflow Oven | 17 August, 2019

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Reflow Oven

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