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Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch

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#83730

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 12 November, 2019

I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.

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#83749

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 14 November, 2019

Maybe something like this could work?

Attachments:

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#83756

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 14 November, 2019

Hi Jandon,

Thanks, I will try it on my DOE.

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#83758

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 14 November, 2019

Yes, 0.25x0.25 square could work @0.1 thickness, use nano-coating or electroform stencil for better solder paste release.

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#83762

Stencil Design for BGA with 0.2 mm Diameter Pad and 0.4 mm pitch | 14 November, 2019

Use a type 5 solder for maximum paste release.

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