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queations about the production of semiconductor component, including wafer IC decrete device

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#83856

queations about the production of semiconductor component, including wafer IC decrete device | 3 December, 2019

We are a chip manufacturer in China for over 20 years. We've been working on chips and wafers for a long time and got pretty much experience. Anyone who have queations about production process? Any queation is OK. Or contact me through email yagzhougenesis@163.com

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#83859

queations about the production of semiconductor component, including wafer IC decrete device | 3 December, 2019

CURIOUS MINDS WANT TO KNOW

Which processes are "front end" and which are "back end"?

Why are they separated like that?

Why are "front end" and "back end" processes usually done in separate plants?

What are the high-value activities?

Which activities have higher levels of automation?

Recent tech news headlines often include references to 14 nm and 16 nm processes. But what do the dimensions 14 nm and 16 nm actually refer to?

What is the difference between DRAM, MPU, and ASIC processing and flash memory processing?

Why are flash memory prices decreasing so rapidly?

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#83862

queations about the production of semiconductor component, including wafer IC decrete device | 3 December, 2019

Trying to find the smiley emoji for your response Dave. Thanks for the laugh.

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#83864

queations about the production of semiconductor component, including wafer IC decrete device | 3 December, 2019

When they redesign the FORUM in a couple of years, I'm going to make the nerds add the whole thumbsUp, thumbsDown, smiley, frownie, and poop emoji thing

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#83865

queations about the production of semiconductor component, including wafer IC decrete device | 3 December, 2019

:poop:

Rats. Just checking.

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