Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

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Stencil design

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SMTA-Davandran

#84999

Stencil design | 17 June, 2020

I have one product which only need print low temperature solder paste on OSP pad. This pad will used for hot bar process. Desired solder paste thickness is 0.10 mm to 0.15 mm. Is any one can advise right stencil thickness and aperture opening for it. Any IPC for solder wettability on OSP surface after reflow.

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#85018

Stencil design | 19 June, 2020

Hope it's helpful for this stencil design.https://pcbboardassembly.com/how-to-understand-ipc-7525a-stencil-design-guidelines/

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SMTA-Davandran

#85020

Stencil design | 19 June, 2020

Thank you for the input

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