loss of metalization on a Earth Pad on a chip component MPN-SBSGP5000102MXT

I am trying to teach a class and the question came up about loss of metalization of the Earth pad on a chip filter. This pad is on the side of the component. I can not find a IPC call out for this type of side termination other than 3 or 5 sided 9.1. not sure that fits this. Where it goes to ground is does it matter if the solder-able surface is missing on the top of the component the data sheet only talks of required width,not height. IPC 8.3.2.10.2 states evidence of wetting. Thank you in advance

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