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Tinned leads and where the component body is defined

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SMTA-64387501

#85585

Tinned leads and where the component body is defined | 2 September, 2020

We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned portion of the leads and the component body. On the received components from the manufacturer, the solder has wicked all the way up the lead under the body. Now the wicked solder does not come off of the lead and touch the surrounding body, but I was under the assumption that solder shouldn't wick fully up the lead so that it is actually on the lead that is underneath the body. If I could show a picture it would be very clear but the part in question is UT54ALVC2525. You can see on its datasheet the lead goes all the way under the body of the component and this is where the solder has wicked all the way up to but does not leave the metalized area.

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SMTA-64386139

#85598

Tinned leads and where the component body is defined | 3 September, 2020

Both conditions are acceptable for this bottom brazed flat pack package. The solder coverage must be within 0.070 inch of the lead/package interface per MIL-PRF-38535, paragraph A3.5.6.3.4.a. While that requirement could allow for a gold gap near the package, that paragraph also allows solder finish on the brazed pad interface areas.

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Solder Paste Dispensing

SMT spare parts - Qinyi Electronics