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Underfill

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SMTA-64386317

#85611

Underfill | 9 September, 2020

Hi, Anybody knew what is appropriate bump height for BGA that will be ideal for underfill process. The undefill must be strong enough to hold the component.

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#85625

Underfill | 11 September, 2020

BGA pitch 0.5??

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#85631

Underfill | 12 September, 2020

Could you just share with us those information :

*BGA datasheet ?? *Stencil design ?? *Stencil Thikness ?? *Type of under-film you want to work with : adhesive or self-adhesive ??

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SMTA-64386317

#85687

Underfill | 25 September, 2020

Yes, 0.5 mm

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SMTA-64386317

#85688

Underfill | 25 September, 2020

Supplier would like to know the appropriate ball height to ensure suit to SMT and underfill process. Undefill using epoxy.

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#85689

Underfill | 25 September, 2020

I didn't understand your request.. Are you talking about underfill process (dispensing) or underfill with tape and reel packaging?? does the component drops at the 2nd reflow? that's why you want to go ahead for underfill process??

Thank you .

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SMTA-64386317

#85690

Underfill | 25 September, 2020

Yes, underfill process with dispensing. Customer require component must withstand certain strength.

This message was posted via the Electronics Forum @ SMTASMTA

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#85691

Underfill | 25 September, 2020

I don't have a past expérience with underfill process , but i can recom 2 track to follow in place of underfill dispensing: 1)Glue dispensing under bga ( complicated process ) 2)Tape and reel under-film ( reliable and controllable process ) ---> 2 process to increase the robustness of the bga against all constraints

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SMTA-64386317

#85692

Underfill | 26 September, 2020

Thank you for sharing this info

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