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Does anyone have experience with LOCTITE ECCOBOND Underfill?

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#85707

Does anyone have experience with LOCTITE ECCOBOND Underfill? | 1 October, 2020

We are looking to underfill a small QFN and have never done this before. I have read the data sheet, but I have specific questions. Does anyone have experience using Loctite Eccobond 1216M?

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SMTA-64386317

#85708

Does anyone have experience with LOCTITE ECCOBOND Underfill? | 2 October, 2020

I am using Bonotek 3400UF and Hysol for underfill application. What is your challenge on underfill process.

This message was posted via the Electronics Forum @ SMTASMTA

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#85709

Does anyone have experience with LOCTITE ECCOBOND Underfill? | 2 October, 2020

Do you preheat the board?

Do you apply on two sides and let it fill under, or along all 4 sides?

Does it bleed away from the part as well, or does it wick under the part during reflow?

Basically, we've never used underfill before. So I don't know what to expect. We are going to practice on some scrap boards that have a similar component mounted.

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SMTA-64386317

#85715

Does anyone have experience with LOCTITE ECCOBOND Underfill? | 5 October, 2020

No pre heat the board and only apply at 2 sided of component. Yes, there is bleeding but as long did not covered nearby component is acceptable. We are using UV oven for curing.

This message was posted via the Electronics Forum @ SMTASMTA

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#85717

Does anyone have experience with LOCTITE ECCOBOND Underfill? | 5 October, 2020

Our application has a ground pad underneath. So I'm not sure if applying on two sides will work.

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