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Solder Ball on PCB pad after printing (DEK)

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#86551

Solder Ball on PCB pad after printing (DEK) | 27 April, 2021

Hi,

I encounter the phenomenon of Solder Ball on pads after printing useing DEK, is someone encounter the same problem? How may i fix it?

best regards,

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#86589

Solder Ball on PCB pad after printing (DEK) | 30 April, 2021

After printing or after the oven? Too much paste - thinner stencil, smaller holes, to rare paste ...

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#86601

Solder Ball on PCB pad after printing (DEK) | 5 May, 2021

Do Proper underneath stencil cleaning. if the cleaning not effective, check Vaccuum section of the printer machine. Else change the Wipe roll. Trying out with other cleaning solvent (dedicated to stencil cleaner) also improve this issues.

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#86609

Solder Ball on PCB pad after printing (DEK) | yesterday at 07:21 PM

Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to minimize solderballs? (Home plate, Reverse Home Plate, etc?) And as others have stated, verify the frequency and thoroughness of the under-stencil cleaning process in the screenprinter. Are you using SPI? If so, adjust your parameters to catch the inconsistencies in volume that could also lead to solderballs.

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