Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Au Thickness in ENIG PCB

Views: 1251

#86599

Au Thickness in ENIG PCB | 5 May, 2021

Hi All, Need your suggestions on the below queries: 1. What will happen if the Au thickness maintained @ 0.5 to 1 micron (Where Ni Thick is within 3 to 5 microns) in 0.2mm Thickness FR4 PCB. 2. Is there any solder quality affcted during Reflow Soldering??

reply »

#86606

Au Thickness in ENIG PCB | 5 May, 2021

0.5 to 1 micron is typically too thick and can result in gold embrittlement of the solder joint. Typical IG thickness is 0.18 microns. see https://www.semlab.com/papers/gold-embrittlement-of-solder-joints/

Ed Hare

reply »

Software for SMT

See Your 2024 IPC Certification Training Schedule for Eptac