Interested in pin-in-paste process with standard ROHS connectors

I don't know about that paste, but I can give my experience trying intrusive reflow (pin in paste).

Using standard Lead-Free paste, we often had issues. It seems that many ROHS parts can't actually handle reflow ROHS temperatures. So the fact that you are looking to low temp is already one in the plus column. Another issue we've had is just getting enough paste down to fill the barrel and get a proper joint. Over printing might be necessary, or perhaps the use of solder preforms. I have had to utilize a few tricks when trying to include pin-in-paste on a 4-mil stencil to increase paste at the TH locations only.

Good luck

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I have used Bi based solder pastes before. What I can say about them is that they are brittle. Joints were cracking easily. This product is something new on the market, so it might be better. Keep in mind to test it for dropping and vibration and joint strength - they say in their website that it performs better than "other low temp alloys". Please share what you get as results - we are very interested to hear. Don't forget, that RoHS connector doesn't necessarily mean its body can withstand reflow temperatures.

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No experience with low temp solders for PIHR but we do use standard lead free 245-255 peak profiles on high temp connectors frequently. Honestly the added cost of the high temp connector pays for itself in labor.

I almost always use oversized apertures on the stencils to get a good amount of solder deposited into the barrel. Nothing special, 4 mil stencil single pass and good barrel fill with a nice fillet on both sides.

One of the other big concerns should be stickout of the through hole leads. I have found that 20-40 mil on the through hole side gives the best results.

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