Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.

Glass BGA

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Glass BGA | 18 October, 2022

IPC states chips and cracks in glass body are defective if beyond specifications. Chips or cracks in glass body beyond the part specification, see Figure 9-18. • Cracked or damaged glass bead beyond part specification (not shown). On some glass BGA components I can not find a specification on the data sheet. What is the risk with these if they have minor cracks or chips on the corners?

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