| | | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be done? | | | | | | Thanks Barb | | | | | i have done that before several times.it is not the same case. | | I just made apertures to print the solder pastes on pads | | Before doing that i had to check out that the dip type parts could last through reflow temp. . | | what i did was to prevent cold solder in DIP type component. | | i printed solder pastes on dip pad with just rectangle shape. | | Afer reflow soldering the solder volume wasn't enough but it is okay the b'd will be taken the wave soldering . | | in that case i did't concern about solder volume. | | the test result was perfect. | | think about in your case | | if the conponent can last the reflow soldering temp. | | the problem is solder volume. | | if the 22 pin connector is dual line you can increase the | | solder volume as you need using the pull back force. | | in my experiment the solder paste in 3mm away from pad can draw to pad when the hole was populated with dip component. (nitrogen reflow) | | you have to make the aperture shape to get max.soler volume. | | remember you have got pull back force. | | and there wasn't fine pitch parts on b'd you can print twice or more to force solder paste into hole. | | | | | | good luck. from south korea. | | | | | | | | Hi Barb, | | look for SPOT (Solder Paste On Through-Hole) in the forum's archive dated aug. 30, 1999 as it also discuss your problem. | | regards, | dreamsniper | |Hi Barb if your board layout allows you can use a step stencil to put more paste volume at the site of your connector. many manufacturers make a higher temperature versions of their components for such applications. check out the site below. good luck John Thorup | | | | | |
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