REWORK PROCEDURES FOR SOLDER BALLS ON BGA PKGS

What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same.

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Check this company out....Winslow Automation. They have a real easy "preform" for reworking BGA's. You just wick the old solder off, flux the packages, attach an appropriate preform, reflow it with a corresponding profile, remove the water-soluble paper and presto...done. Call (408)526-1213 and ask for Jennie Tat. No advertising, they just work. Regards.

| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. |

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| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | 3: I'm unaware of such documentation, but then again documentation from folks like IPC lags practice.

It's unclear that reworking and replacing BGAs is good practice. Motorola does not follow the practice. I quoted the source for this statement in a recent SMTnet thread:

Reliability of Reworked BGAs/CSPs - Michael Allen 15:18:25 02/03/1999

Each company should develop practices that reflect the product they ship.

TTYL

Dave F

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| What are some suggested standards/speced requirements and procedures for removal/addition of missing balls on laminate and ceramic based bga packages and quality requirements for same. | There are a number of methods available. 4 of them are discussed in the July 1999 issue of Circuits Assembly Magazine. I prefer the stencil method of ball placement. There is a company providing a re-balling service, check them out below.

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