| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are currently soldered using paste/oven reflow. | Does anyone have suggestions for an adhesive and process (pre-solder or post-solder application). | | Thanks. Andrew | Andrew, I have used Loktite chipbonder 360 in the past with very good results. It is in the 500 kps range, but I am not sure off hand of its thermal properties. This is a heat cured material. I use the standard adheasive dispenser on my Contact 3AV P&P to dispence prior to placement of the component. The adheasive cures at about 170 C.
Hope this helps. CL
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