Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


Forced air drying after aqueous cleaning

pallen

#2512

Forced air drying after aqueous cleaning | 8 November, 2000

I know there must be a specification for this but I don't know what it is. What is the maximum psi setting for an air line that is used to dry assemblies off an aqueous cleaner? The assemblies are fixed but predominately SMT with many 0602/QFP/BGA components.

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#2513

Re: Forced air drying after aqueous cleaning | 8 November, 2000

The style of US standards has been moving away from such specifications for some time. So, the approach has become ...

Here�s what I want ... Functioning, built to print, clean, undamaged boards. Here�s how I want you to do it ... I don�t care, just meet my requirements.

Europeans seem more heavy handed in such "thou shall / thou shall not" issues. May be your answer is there.

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