EP&P Magazine, MDS Artical

If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular components with simular cracks, one from MDS and the other from Thermal cycled, it fact the crack is identical (notice the debris around the pad is the same in both pictures). Was this intentional hmmmmm.

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| If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular components with simular cracks, one from MDS and the other from Thermal cycled, it fact the crack is identical (notice the debris around the pad is the same in both pictures). Was this intentional hmmmmm.

Furthermore, the Idea that twisting a board will simulate the effects that a stress thermal cycle would show is ludicrous. Why don't we just throw the boards against a wall 1000 times and count the cracks? My guess is the results would be similar. Stuff like this should not be published without Statistical data to back it up. There is a disclaimer at the end of the article, perhaps it should have been placed at the front of the article to save us from reading meaningless articles. OK I am Done John

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| | If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular components with simular cracks, one from MDS and the other from Thermal cycled, it fact the crack is identical (notice the debris around the pad is the same in both pictures). Was this intentional hmmmmm. | | Furthermore, the Idea that twisting a board will simulate the effects that a stress thermal cycle would show is ludicrous. Why don't we just throw the boards against a wall 1000 times and count the cracks? My guess is the results would be similar. Stuff like this should not be published without Statistical data to back it up. There is a disclaimer at the end of the article, perhaps it should have been placed at the front of the article to save us from reading meaningless articles. | OK I am Done | John

Way to go big john...

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| | If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular components with simular cracks, one from MDS and the other from Thermal cycled, it fact the crack is identical (notice the debris around the pad is the same in both pictures). Was this intentional hmmmmm. | | Furthermore, the Idea that twisting a board will simulate the effects that a stress thermal cycle would show is ludicrous. Why don't we just throw the boards against a wall 1000 times and count the cracks? My guess is the results would be similar. Stuff like this should not be published without Statistical data to back it up. There is a disclaimer at the end of the article, perhaps it should have been placed at the front of the article to save us from reading meaningless articles. | OK I am Done | John Don't ya' just hate that kinda' stuff? The ones that always get me is when some company is advertizing a pick and place machine, and they have a picture of a board in the machine, under the nozzles, that's supposedly getting placed... the only problem is that normally if you look closely, most of the time the board is already soldered! Makes you think that the marketing types think we're a bunch of idiots! I'm done now too...(GRIN) -Steve Gregory-

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| Don't ya' just hate that kinda' stuff? The ones that always get me is when some company is advertizing a pick and place machine, and they have a picture of a board in the machine, under the nozzles, that's supposedly getting placed... the only problem is that normally if you look closely, most of the time the board is already soldered! Makes you think that the marketing types think we're a bunch of idiots! | I'm done now too...(GRIN) | -Steve Gregory- Steve: Those "marketing types" are usually ghost writers that know very little about the industry, equipment, technology requirements, what is or isn't important and most importantly do not care who reads the artical as long as you look at the paid for ad! Nice to see you writings again.... Wayne

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