Voids in micro-BGA solder joint

I'd like someone gives me a tip for elemating of voids in the mico BGA solder joint and the method of inspection of them, very exactly.

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| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly.

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We have a x ray inspection criteria video and poster set which may be of interest check out our home page www.bobwillis.co.uk

| | I'd like someone gives me a tip for elemating of voids | | in the mico BGA solder joint and the method of inspection | | of them, very exactly.

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Place your components directly on the PCB without using solder paste,unless your using high temp. solder spheres then you should use paste. If eutectic solder spheres are used try fluxing the BGA area and attach it directly to the board. This will reduce voids. We use an SRT -1000 rework machine to attach directly to the board. For inspection we use the Nicolet Imaging x-ray. Hope this helps, Feel free to call or e-mail me for more info. 508-453-4667 ext, 349

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| I'd like someone gives me a tip for elemating of voids | in the mico BGA solder joint and the method of inspection | of them, very exactly. Voids in excess of 20% by each solder ball volume is cause for rejection. Causes are improperly managed processes as soldering, solder paste selection, when used, contamination as excessively oxide solder surfaces (often HASL coated boards or contaminated solder balls). Prevent defect at the design level. Use real time gray scalle or very high resolution black and white x-ray to determine voiding and solder joint quality.

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