How in earthly heaven would someone else have a report analyzing the defects on your boards? Among the good failure analysis labs that can assess situations like yours are: * Robisan Laboratory 6502 East 21 St Indianapolis, IN 46219 317-353-6249 fax 357-1270 Susan Mansilla, Technical Director Robisan1@aol.com * Trace Laboratories - East 5 North Park Dr Hunt Valley, MD 21030 410.584.9099 Fax 9117 tracelab@connext.net http://www.tracelabs.com
Other reputable failure analysis labs are listed at http://www.ipc.org
Thinking about your situation, where the fine pitch parts do not soldering well, when other components do solder well � tell us: * Initially, it would seem there is a problem with the fine pitch parts, but you stated that fine pitch pads without components soldered poorly [and it�s probable that all of the fine pitch parts are not from the same supplier]. So, do the fine pitch components that did not solder well on the board have acceptable solderability? * That, generally, the boards solder well, except the fine pitch parts, raises the issue of a substance is between the copper on the pads and the HAL. Is the substance copper corrosion, solder mask bleed, board fab processing materials that were not removed, or what? On a board with poorly soldered fine pitch parts, can you solder a pad with an iron and a fairly active flux [not that fine NC stuff]? If not, will it take solder, after scraping the pad with a xacto knife blade? What kind of solder mask is on the board? * What is your board supplier doing to help you understand this issue? * How do you process and what materials do you use on these boards? * With regard to the problem, what is the history of processing this board? What is the extent of the problem, across product lines?
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Hi.
After reflow soldering. There are lots of non wetti...
- Sep 14, 2001
by
park kyung sam
How in earthly heaven would someone else have a report analy...
- Sep 14, 2001
by
davef
