Yes!!! How can we assemble boards with 20 pitch when we allow 0.008� error to the master art? Excellent question!!!
IPC-D-300G has nothing to do with assembler requirements. It is written by and for fabricators, so that they can be comfortable.
Being at the 0.008� limit is extreme. Your supplier is too comfortable. Sure they can say they met spec, but that sure doesn�t meet your needs. You�re paying the price of your buyer being a hero [and probably getting a BIG bonus] by reducing the bought-in price on that board. Check some boards from your other suppliers. They probably are not as bad as these.
If your supplier is hanging-out the upper spec limit, there�s no telling what they�ll do in their next shipment.
I want to say Mikie was frothing about this within the past two months on SMTnet. Search the fine Archives.
In this stretch effect, the larger the board, the more severe the growth (or shrinkage) it will have. Stretch also depends on the board house capabilities and controls and board thickness. The best way to minimize stretch effect is to group components that require tight tolerance into the central location of the PCB.
Other contributing factors are: * Stencil stretch: 0.001" per inch for chem etched stencils was the best we could get a few years back. * PCB warpage: Contributes to the problem. * PCB solderability protection: The thermal gradients seen in the HASL process contribute to both warpage and stretch. If using a HASL finish, consider OSP or ENIG finish. * Screen print: Vision system on the printers? Optical alignment of stencil pattern (round half-etched fiducials on the bottom side of the stencil seems to work well) to board pattern is crucial. Of course foil thickness, aperture design, and squeegee material all play a role.
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