Are there formalized standards for the properties of solder balls? No
Get IPC-7095 �Design & Assembly Process Implementation for BGA's�.
General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Plastic packages like softer solders like 60/40. * Size and pitch of the package influences solder ball size.
JEDEC focuses on package outlines. JEDEC has issued several BGA-related specifications. These include: MO-149 - Tape BGA / square MO-151 - PBGA / square MO-156 - Ceramic BGA / square MO-157 - Ceramic BGA / rectangular MO-158 - Ceramic column Grid Array / square MO-159 - Ceramic Column Grid Array / rectangular MO-163 - PBGA / rectangular
I can't say one way or the other if these specifications go into the type detail you seek.
Look for a review of �Area Array Packaging� by Ken Gilleo in the SMTnet Newsletter within the past couple of months.
Just out of curiosity, what is the point in trying to understand this information? Frankly, most of us are just glad when the packages have all the balls attached and that they solder.
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