Systems for Solderability-tests

Among the BIG concerns that we have with J-001 is 5.4, Solderability Maintenance. It states "the manufacturer must ensure that all components, parts, leads, wiring, terminals and printed boards... are solderable at the start of hand and/or machine soldering operations." I don't know how to do this except to perform solderability testing prior to assembly.

Solderability testing is a BIG problem. * Performing tests is operator dependant. In QA talk => it has a lousy gage. * Solderability testing machines from different suppliers produce dissimilar results. * Tests don�t well represent in-use. For instance, how does one test the solderability of a BGA? [Ooo, ooo. I know the answer. => For BGA and other parts that do not lend themselves to solderability testing, J-002A, 1.7 states, "In cases where the stated test parameters are inappropriate or insufficient, alternate parameters may be agreed upon between vendor and user." Izat blank, erwat?] * How do you hold a 0201 in a clip made for a 0805? * How do you hold a thumbwheel switch? * How deep do you immerse some of these wonderfully designed components that only have solderable surfaces on the vertical side of the part?

Solderability tester suppliers are: * Robotic Process Systems Six Sigma * Concoat acquired Multicore SPCID. [This includes MUST II and Contaminometer.] * CMI * Kester * Cemco

Many companies just cob-up their own in-house method. Standards are: * J-STD-002A for component solderability * J-STD-003 for printed wiring board solderability

Contact Dave Hillman [ ddhillma@rockwellcollins.com ]. He leads an IPC solderability committee.

Contact solderability testing service providers, such as: * Soldering Technology International * EMPF

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