I am completely new to SMT design and for my next project I plan to use SMT for the first time. Since production volumes of the PCB's will be low, hand soldering is definitely an option, and will be necessary for my prototype PCB assembly.
My problem is, how do I calculate SMT component pad sizes, suited for handsoldering. I do know the IPC tools and standards but they all refer to reflow soldering.
Are there any 'rules of thumb' to translate a reflow pad to a hand solder pad? Can I use the reflow pad sizes as well for hand soldering? Are there any pittfalls I should take into account?
By the way, I already bought a METCAL 500 soldering station with a number of tips (including a mini hoof tip) to solder my SMT components.
I will be dealing with 0805, SOIC and TQFP (34 up to 64 pins) packages most of the time.
An extensive search on this issue on the internet thit not reveal the answer to me yet.
Any comments and suggestions are welcome!
Thank you.
Rudy Van Raemdonck MODELTECH
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