First, skewing is a perfectly acceptable condition, providing the amount of skewing is not excessive. A-610 provides guidance.
Second, this part is a land grid device. Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. Generally, any device that has bare pads under them that attach to corresponding pads on the board qualifies as a land grid.
Third, watch out for LGA with a thermal "slug" under them, like a QFN [and the drains on your MOSFET]. The slug really limits the options if overprinting. If the opening for the thermal slug is too great when using blades (not a pump), the blades can "scoop" paste from the center of the deposit for the slug. Since the pads do not get scooped, the component can end-up sitting higher than the paste deposits under the heat sink. Support the board under the component if the paste opening is larger than about 100-125 thou^2. Print the heat sinks as a grid of apertures that are the size of pads.
reply »