Printed Circuit Board Assembly & PCB Design SMT Electronics Assembly Manufacturing Forum

Printed Circuit Board Assembly & PCB Design Forum

SMT electronics assembly manufacturing forum.


BGA PROCESS MATERIAL

MRMAINT

#27321

BGA PROCESS MATERIAL | 19 February, 2004

LOOKING FOR THE PROS AND CONS OF BOTH WATER SOLUBLE AND NO CLEAN PROCESS MATERIALS AS IT APPLIES TO BGA REFLOW.IS IT POSSIBLE TO REMOVE ALL W/S FLUX AFTER INLINE WASHING.

THANKS MRMAINT

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#27332

BGA PROCESS MATERIAL | 20 February, 2004

We successfully clean WS flux on 1mm and 1.25mm pitch BGA. For 0.8mm pitch BGA, we use no clean, because we cannot remove the flux residue from under them efficiently.

Use ion chromatography testing to be sure it is clean under the BGA. IC is the only way to be sure you can clean sufficiently.

As a down & dirty method for determining capability of cleaners: * Make some glass [heat resistant tempered glass] slugs that are bigger than the BGA you plan to clean. * Glue several BGA to glass slugs at different stand-off heights. * Squirt colored flux beneath the slug. * Send BGA/slug through a reflow oven to bake the flux. * Clean the glass plate. * Inspect the slug after it comes out of your cleaner. That'll show you without a doubt, the capability of your cleaner.

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