Notes from an AIM No-Lead Presentation ...
Wave Soldering * May require a higher pot temperature than tin/lead: 255-265*C * May require a change in liquid fluxes to compensate for the poor wetting of some alloys and high thermal stresses of the wave process. * Makes OSP a bad choice for wave soldered boards.
Solder Maintenance * Certain lead-free alloys, such as Sn/Cu, suffer from high copper dissolution rates. * Unfortunately, whether Sn/Cu or Sn/Ag/Cu is implemented for wave soldering, the density of both alloys is less than Sn63/Pb37. Therefore, instead of the intermetallic floating off and easily being removed as when in Sn63/Pb37, the intermetallics sink and are dispersed through the lead-free alloy in the pot. This could result in additional solder maintenance and pot dumps. * The good part of this density issue is: it takes less more expensive solder to fill your pot. [Maybe that's not so good after all, erzit?] * Probably have to watch copper concentration more closely than with SnPb.
Wave Soldering Equipment * Most modern wave solder machines can provide the necessary heat (preheat and wave) for lead-free soldering. * Nitrogen blanket may be required, depending upon the alloy selected. * High-tin alloys rapidly dissolve the materials often used in wave solder equipment. SS pots, nozzles, impellers, etc will need to be replaced with cast iron, titanium, or a special coating. * Wave soldering equipment manufacturers have had success using a Melonite coating over SS. ["Equipment Impacts of Lead Free Wave Soldering" Morris and O�Keefe. APEX 2003] * Converting a SnPb filed cast iron pot to lead-free requires removing the SnPb, then two cycles of filling, running, and removing pure Sn. [Recyclers dream.]
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