Q1: How does one distinguish between hard gold and immersion gold? A1: Distinguish between hard gold and immersion gold by measuring the hardness of the gold. We�d expect the hardness of hard gold to be >90 Knoop.
Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125 microns [3 - 5 microinches]. * Nickel thickness of 3 - 6 microns [120 - 240 microinches]].
Q3: What happens if the gold drops below 3" [sic 3uin]? A3: 3uin electrolytic gold is porous and allows corrosion of Ni underplate, resulting in lousy soldering. Although not as necessary, we like to see immersion gold thicker than 3uin, also. [just old fuddy-duddies talking here though.]
Q4: What happens if nickel is above 350" [sic 350uin]? A4: If Ni is >150uin, the assembler wastes money.
Q5: What are the typical failure modes associated with hard gold surfaces? A5: When we hear �hard gold�, we think of wear * Could be solderable surfaces, but usually the people that specify �hard gold� for solderable surfaces don�t know what they�re talking about and have just tweeked their wear surface spec to become something that they reason to be a solderability spec. See, platers create hard gold by alloying cobalt [or maybe nickel] with fairly pure [soft] gold. Obviously, if you're soldering, you don't want Co alloying with your solder. [Let us know when you find a phase diagram for that.] * Wire bonding is soft gold, no discussion.
So anyhow, we�re talking wear. Common "hard gold" failures are: * Discolored gold. * Gold that is poorly attached to the nickel. * Poor thickness control. * Low thickness. * Pitting. * Damaged solder mask.
Finally, both 'hard' and 'soft' gold pertain to electrolytic gold. Neither applies to immersion gold, which is a completely different process.
Q6: Can somebody direct me to literature concerning soft gold? A6: When we want to refresh on board fab issues, we scamper over to the bookshelf as fast as our stubby legs can carry us and grab Coombs' "Printed Circuits Handbook" [McGraw-Hill 5e ISBN: 0071350160 ]
Plating books are: "Electroplating: Fundamentals of Surface Finishing" Lowenheim, FA (0070388369 McGraw Hill) (1872422039 Electrochemical Pub) "Graham's Electroplating Engineering Handbook" 4Ed, Durney, LJ Chapman & Hall (0412741105) "Modern Electroplating : Electrochemical Society Series" 3Ed, Lowenheim, FA John Wiley (0471549681) 'Metal Finishing Guidebook and Directory'. Published annually by Elsevier Science Publications, New York, New York, USA. ISSN 0026-0576.
Lecture notes on plating: http://www2.ece.jhu.edu/faculty/andreou/495/2002/LectureNotes/Plating.pdf
Rudy Sedlak�s take on non-electrolytic plating processes: http://www.pcbfab.com/connecto.html
We've observed that you've been working this gold issue for a couple of weeks now. Is there a specific issue that we should be discussing?
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