solder paste coverage

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I'am having a problem with 0805 component where right after ... - Jun 01, 2005 by devilhitam

It's unusual to use a horseshoe shaped pad for a 0805. Comm... - Jun 01, 2005 by davef

devilhitam

#34672

solder paste coverage | 1 June, 2005

I'am having a problem with 0805 component where right after placement, the component tend to move from the pad. I'am using 'horse shoe' aperture for 0805 component to resolve the solder beading issue. Does this 'horse shoe' contributing the skew/shift problem? Is there any standard for solder amount underneath the component before reflow process? and also recommended solder volume for desired pad?

Pls help and advice

Thanks

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davef

#34673

solder paste coverage | 1 June, 2005

It's unusual to use a horseshoe shaped pad for a 0805. Commonly when people want to reduce the paste volume to reduce solder balling, they print a "home plate" aperature.

We print paste 1:1 with the pad.

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